Epoxy Potting Compound 149
Product information:
A two-component condensation material designed for hermetically sealing and insulating electronic, electrical, telecommunication and radio engineering components.
This Epoxy Potting Compound 149 stands out among similar products — its greatest advantages include high mechanical strength, exceptional adhesion to various materials and excellent electrical insulation properties, ensuring reliable protection in demanding conditions.
Versatile and effective, Epoxy Potting Compound 149 is a great choice for industrial production facilities as well as electronics enthusiasts and DIY hobbyists.
Epoxy Potting Compound 149 – Application Process:
Our Epoxy 149 is exceptionally easy to use, making it an ideal choice for both professionals and less experienced users. Its easy mixing and quick curing make the application process convenient and efficient.
Surface Preparation:
Surfaces intended for potting should be properly prepared. They should be cleaned of all mechanical contaminants, e.g., using sandpaper, and then degreased (e.g., with acetone). For metals, chemical etching in a suitable bath may be used.
Mixing the Components:
The components of Epoxy Potting Compound 149 (potting resin and hardener) should be mixed at room temperature in the following ratio: 100 parts by weight of Epoxy 149 and 12 parts by weight of the hardener. It is important to mix the components thoroughly until a homogeneous mass is obtained. It is recommended to prepare small amounts of the mixture that will be used within a few minutes to avoid curing issues.
Application and Curing:
Curing of Epoxy Potting Compound 149 can be carried out at room temperature. After curing, the product has a light yellow color. The process takes 7 days for full mechanical strength and 14 days for chemical resistance. To avoid curing leftover resin on tools, it is recommended to clean application equipment promptly using a solvent, such as acetone.
Can of 100 gram + syringe with hardener.
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