Solder paste Easy Print Sn96.5/Ag3/Cu0.5 AGT-028 syringe 6g

Solder paste Easy Print Sn96.5/Ag3/Cu0.5 AGT-028 syringe 6g

Product information:

Solder paste Easy Print Sn96.5Ag3Cu0.5 is an innovative agent used in the SMD soldering process.
This lead based solder paste is ideal for both automated soldering and manual printers.

This lead-free Easy Print solder paste is undoubtedly a reliable and versatile solution for everyone who values quality and efficiency in soldering processes. With its excellent properties, ease of use and flexibility, it is the ideal choice for both professional manufacturers and hobbyists.

Syringe with 6g of paste.

Features:

High Purity: Easy Print contains 96.5% tin, 3% silver, and 0.5% copper, ensuring effective and durable connections.

No Clean Paste: Post-soldering residues do not require cleaning and do not cause corrosion, simplifying the production process.

Versatile Use: Ideal for soldering SMD components, making it suitable for both professional workshops and home use.

Safety and Efficiency: Chemically neutral to most materials, ensuring safe usage on various devices.

Resistance to Mid Chip Solderballing: Ensures high-quality soldering and minimizes the risk of defects.

Contour Fidelity: Maintains accurate contours even during 8 hours of continuous printing, extending stencil life.

Compatibility with Lead-Free Alloys: Compatible with all lead-free alloys, making it a versatile choice for various electronic applications.