Thermal paste Copper Syringe 1.5ml

Thermal paste Copper Syringe 1.5ml

Product information:

Thermal Paste Copper is a modern solution for anyone looking to enhance the cooling efficiency of their computer. Designed to meet the high demands of professionals and technology enthusiasts, this copper-based paste offers more than just standard cooling with its 3.1 W/mK thermal conductivity. It is a technologically advanced product that will transform your equipment, ensuring maximum performance with copper radiators.

• High Thermal Conductivity: Thermal Paste Copper is enriched with copper compounds, providing a thermal conductivity of ~3.1 W/mK. This effectively dissipates heat, which is crucial for the optimal performance of your equipment. The copper color of the paste visually highlights its advanced technology.
• Versatile Application: Ideal for filling micro-inequalities between contacting elements, such as the processor and radiator. It also performs excellently in cooling power systems like converters, motor controllers, and power amplifiers. Its universal application makes it indispensable in computers and advanced electronic systems.
• Thermal Stability: Thermal Paste Copper minimizes thermal resistance, resulting in better cooling and extended lifespan of electronic components. It operates effectively over a wide temperature range from -50°C to 250°C, and temporarily up to 340°C. It is perfect for applications requiring high reliability in extreme conditions.
• Physicochemical Properties: Copper has a density of ~2.9 g/cm³ at 20°C and does not evaporate, ensuring long-lasting effectiveness. Its viscosity prevents it from flowing, and a thixotropic index of 380 ± 10 allows for easy application.
• Excellent Dielectric Properties: The specific cross-resistance is 3.8 x 10¹⁴ Ohm x cm, providing excellent electrical insulation. The dielectric loss factor tg δ at f=120 Hz is 0.013, and the relative dielectric constant εr at f=120 Hz is 13.6, further emphasizing its advanced dielectric properties.