Thermal paste Gold Syringe 3g
Product information:
An advanced solution for professionals and technology enthusiasts who demand maximum cooling performance. The paste, enriched with gold particles, offers thermal conductivity of 3.57 W/mK, ensuring effective heat dissipation and protecting components from overheating.
Thanks to its exceptional dielectric properties and wide operating temperature range, it is an ideal choice for computers, energy systems, and industrial installations.
Features:
- High Thermal Conductivity: Enriched with gold particles, Thermal Paste Gold provides exceptional thermal conductivity at 3.57 W/mK. This ensures effective heat dissipation, which is crucial for the optimal performance of your equipment. Its golden color visually highlights the advanced technology and exclusivity of the product.
- Versatile Application: Ideal for filling micro-gaps between contact surfaces, such as between the processor and the heat sink. It also excels in cooling advanced energy systems like solar collectors. Its universal application makes it indispensable in both computers and specialized industrial installations.
- Thermal Stability: Thermal Paste Gold minimizes thermal resistance, leading to better cooling and extended lifespan of electronic components. It operates effectively over a wide temperature range from –50°C to 250°C, and briefly up to 340°C. It is ideal for applications requiring high reliability in extreme conditions.
- Physicochemical Properties: Gold features a density of 2.35 g/cm³ at 20°C and does not evaporate, ensuring long-lasting effectiveness. Its viscosity ensures it does not flow, and a thixotropic index of 380 ± 10 allows for easy distribution.
- Excellent Dielectric Properties: With a volume resistivity of 2.2 x 10¹⁴ Ohm x cm, it provides excellent electrical insulation. The dielectric loss tangent tg δ at f=120 Hz is 0.005, and the relative permittivity εr at f=120 Hz is 7.7, further emphasizing its advanced dielectric properties.